Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...

Here’s a PCB fabrication process that makes us envious. It’s pretty darn close to fab-house quality at home. [Cpirius] is using a CNC mill and through hole plating technique to produce his ...